Canned enclosed circuit

专利摘要:

公开号:DK200800232U1
申请号:DK200800232U
申请日:2008-12-02
公开日:2009-01-09
发明作者:Holm Jens Peter
申请人:Ferroperm Emc Aps；
IPC主号:

专利说明:

1DK 2008 00232 U3
Title: Canned enclosed circuit
This provision relates to a hermetically enclosed circuit, for example, a filter circuit with connection terminals discharged.
Prior art
Today, hermetically sealed filters are manufactured by providing a sleeve containing the filter with a hermetic seal made in "kovar glass cowhide". These seals are relatively expensive. In addition, they are difficult to use as they are very sensitive to the temperature gradients that typically occur upon inlet into the sleeve. Therefore, the seal is not completely sealed if exposed to high temperatures, such as temperatures above 500 ° C, which are the temperatures usually encountered by soldering.
The technical problem to be solved
It is intended to provide a hermetically sealed seal against gases such as helium, although it has been exposed to relatively high temperatures, such as temperatures above 500 ° C.
The nve technique
A hermetically-enclosed circuit of the type mentioned above is new in that it is enclosed in a sleeve, preferably a silver sleeve, the connecting terminals projecting at the ends of the sleeve being sealed by a chamfered ring of alumina or alumina-like material. the soldered surface is soldered to the connecting terminal and the inside of the sleeve, respectively, and the beveled faces prior to soldering are coated with a titanium bonding layer which is subsequently gilded, which beveled ring is beveled at both the inside and the outside.
2 2GB 2008 00232 U3
The technical impact
This results in a seal that is very dense, even against helium, even though the seal has been exposed to high temperatures. In addition to the chamfering of the solder, the chamfering also means that the path to be taken by possible helium penetration becomes longer, thereby reducing the risk of helium seepage if there is a risk of helium seepage at all.
Furthermore, according to the production, the bevel angle may be approx. 45 °.
The invention will be explained in more detail below with reference to the drawing.
Fiaurforteanelse
Figure 1 shows a hermetically enclosed filter circuit, partially in section, Figure 2 a sealing ring for the hermetically enclosed circuit, Figure 3 the components of a π filter and the associated diagram, and Figure 4 the components of a T-fiiter and the associated diagram. . Embodiments
The hermetically enclosed filter circuit shown in Figure 1 is enclosed in a sleeve 1, such as a silver sleeve, a silver sleeve, a gilded sleeve or other material combinations, with connecting ends terminating at the ends of the sleeve 2. ring 3 of alumina. This ring 3 is soldered to the connecting terminal 2 and the inside of the silver sleeve 1, respectively, in which a circumferential notch is provided in which the sealing ring 3 can rest. The alumina ring 3 3DK 2008 00232 U3 3 is bevelled at both the inside and the outside, and the bevel angle is 20-70 °, preferably 45 °. The beveled surfaces 3a, 3b are coated, before soldering, with a bonding layer of titanium of a thickness of approx. 50 pm. The titanium layer is protected against oxidation of a gold layer of a thickness of approx. 1 pm On top of this gold layer is a silver layer of a thickness of approx. 10 μηη. The planar side of the alumina ring is abraded to give an alumina ring 3 with two small titanium-um / gold / silver rings, cf. Figure 2.
Thus, after soldering to the connection terminal 2 and the inside of the silver sleeve 1, a seal which is completely tight is also obtained against helium. In addition to the chamfer giving way to the solder, the chamfer 3a, 3b also causes the path to be paved by any penetrating helium to become longer, approx. -Jl times longer if the bevel angle is 45 °, thereby reducing the risk of seepage correspondingly if there is at all a risk of seepage of e.g. helium.
Figure 2 shows the bevelled ring seen from the side and from above, respectively.
Figure 1 also shows a high temperature solder 4.
Figure 3 shows the components of a π filter and the associated diagram. The π filter comprises an inductor L connected to the input and output terminals 1, 2, respectively, both terminals being grounded via a capacitor C. The inductor L is f. eg. at 1 pH, while capacities C e.g. is at 2n F. The ground connection is made up of the silver bushing 1.
Figure 4 shows the components of a T-fiitter and the associated diagram, Two series connected Inductors are connected to the input and output terminals respectively, while the connection point between the inductors is connected to ground via a capacitor. The ground connection is made up of the surrounding silver bushing 1. each having a value of 0.5 pH, while the capacitor may have a value of 2 pF.
DK 2008 00232 U3 4 The sealing ring 3 can e.g. have an outer diameter of 3.7 mm, while the hole in the sealing ring may have a diameter of 0.85 mm.
The contained circuit is not necessarily a filter circuit. Other circuits 5 may come up.

权利要求:
Claims (2)
[1]
1 Canned enclosed circuit, for example, a filter circuit with connecting terminals (2) discharged, which circuit is enclosed in a sleeve 5 (1), preferably a silver sleeve, which is new in that it is at the ends of the sleeve (1). ) protruding connection terminals (2) are sealed by a beveled ring (3) of alumina or an alumina-like material soldered to the connector terminal (2) and the inside of the sleeve (1), respectively, the beveled surfaces prior to soldering being coated with a titanium bonding layer which is subsequently gilded, which beveled ring (3) is beveled at both the inside and the outside.
[2]
Circuit according to claim 1, which is new in that the bevel angle at the inside and outside respectively is approx. 45e.

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同族专利:

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公开号 | 公开日

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DK200800232U3|2009-04-24|

引用文献:

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公开号 | 申请日 | 公开日 | 申请人 | 专利标题

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法律状态:
2013-05-24| UBP| Utility model lapsed|

优先权:

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申请号 | 申请日 | 专利标题

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DK200800232U|DK200800232U3|2008-12-02|2008-12-02|Canned enclosed circuit b|DK200800232U| DK200800232U3|2008-12-02|2008-12-02|Canned enclosed circuit b|